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世界先进赴新加坡建晶圆厂，全球芯片供应链积极“去中化”

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Metadata
  • 世界先进赴新加坡建晶圆厂，全球芯片供应链积极“去中化”
  • June 17, 2024
  • Category 每日视频新闻
  • Content Type Package
  • Language 中文 (Chinese)
  • NewsML Media Topics Arts, Culture, Entertainment and Media
  • Subtitles / Dubbing Available No
  • Network VOA
  • Expiration Date July 17, 2024 08:27 EDT
  • Embargo Date June 17, 2024 08:36 EDT
  • Brand / Language Service 美国之音中文
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